BEZPIECZNIKI TERMICZNE

THERMAL CUT-OFFS (THERMAL LINKS)

Responsive, Reliable, Inexpensive, "One Shot"

Thermal fuses (Thermal Links) provide the most cost-effective "one-shot" or single operation over-temperature protection for small appliances, resistive heating elements, business machines and FHP motors. The "spring & pellet" design responds to temperature by interrupting an electrical circuit when the operating temperature exceeds the thermal rating of the fuse.

Temperature Ratings
Maximum Opening Temperatures
TCO Part
Number
Temp °C
TF
Temp °F
TF
TCO Part
Number
Temp °C
TF
Temp °F
TF
D070 72 162 D115 117 243
D076 77 171 D118* 121 250
D081 84 183 D125 128 262
D085 87 189 D139* 141 286
D088 90 194 D149 152 306
D090* 93 199 D165 169 336
D096 98 208 D181 184 363
D098 100 212 D213 216 421
D103 104 219 D226* 228 442
D108 109 228 D242* 240 464
Temp Tolerance: 0 to-4°C (0° to -7.2°F)
*Temp. Tolerance: +0° to -6°C (+0° to -10.8°F)


DXXX Series:
Thermal cut-off with an 18 awg tin plated copper case end lead.

DXXXA Series:
Thermal cut-off with a 23 awg case end lead. Developed for ease of placement in windings.

DXXXC Series:
Thermal cut-off with an 18 awg steel case end lead is available, when required.

Resistive Ratings


UL*
CSA
120VAC
16.7/25 Amps
16.7 Amps
240VAC
16.7/25 Amps
16.7 Amps
277VAC
15/20 Amps
15 Amps
IEC Ratings available upon request
*Max normal currect carrying capabilities/overload value

Internationally Approved:
Type DXXX

Approval Agency Certificate Numbers

Approval Agency Certificate Number Standard
UL E49429 UL 1020
CSA LR 43279 C22.2 NO. 209
BEAB CAL0051 IEC691/EN60691
VDE DE1-4434 thru 4437 & DE1-4736 IEC691/EN60691
MITI H Series 33-735 thru 33-741 IEC691/EN60691
FEMKO 095875-01-03 PUBL.E128(CEE 28)
SEMKO 7979904-01 SEMKO 111/CEE 11
SEV 737 003 SEV 1020.1965
UTE 19 479a 19 481 NF C 73-600
KEMA 86.7665 K29A.07
Note: Types DXXXA & DXXXC are UL & CSA Recognized

These Thermal Links are intended for use in: tropical climates
Resistive & Inductive circuits, have a comparative tracking index exceeding 250,
and are suitable for sealing in or use with impregnating fluids or cleaning solvents.

Note: Consult the manufacturer when encapsulation or use of
cleaning solvents is being considered. These operations may damage
the TCO (Thermal Link).